Job offer: Engineer (Bonding Process)

Position: Engineer (Bonding Process)

Responsibilities:

• Design process parameters, prepare engineering specifications documentation, and provide training to those involved in the process.
• Monitor, analyze, and evaluate the process's performance, quality, and cost-effectiveness.
• Monitor and control the process to ensure compliance with specifications, troubleshoot issues, improve processes, and evaluate quality in production.
• Analyze and evaluate new raw materials to reduce costs or improve quality levels.
• Install new machinery, troubleshoot issues, and improve machine efficiency (in collaboration with Machine Engineers).
• Analyze and evaluate quality issues, customer complaints, OQC (Outgoing Quality Control), and simulate defect occurrences.
• Analyze and make decisions regarding the management of non-conforming products.

Qualifications:

• Male or Female, Age 25 – 35 years old.
• Bachelor's degree Industrial Engineering, Electrical Engineer, Engineering or  Materials Science, or other related fields.
• Experience in bonding processes (Die/Wire bond) in electronic device manufacturing, with proficiency in adjusting and troubleshooting Die/Wire bond machine parameters.
• Proficient in using computer programs such as Microsoft (Excel, PTT), Minitab and Auto Cad
• Good Command in English.